IoT Communication Module Industry Research: Stable Pattern, High Tide Continues

Module Introduction:5G drives the arrival of the era of lpwa 5gsmart connection of all things

Mobile through the Internet development dividend peaked, 5G drive the era of the smart connection of everything has come

The mobile Internet dividend driven by 3G/4G networks is diminishing. For the past two decades, the Internet has been centered on people's networks. Fixed-line broadband allowed people to access the Internet through their personal computers and connect the first generation to the Internet, and since then, mobile networks have continued to improve through iterations. 3G/4G networks enabled second generation person-to-person connectivity by allowing people to access the Internet through portable mobile devices. Over time, the mobile Internet dividend has begun to wane, with slow growth in the number of mobile users and sluggish growth in shipments of consumer electronics terminals such as PCs/smartphones. It is expected that 5G will drive the Internet of Things to replace the Internet of People as the new direction of industry development in the next decade.

IoT industry structure: integrated sensing, reliable transmission, intelligent processing of connection system

IoT is an intelligent service system that connects things, people, systems and information resources through sensing devices in accordance with agreed protocols to achieve information processing and response in the physical and virtual world. Sensing, reliable transmission and intelligent processing are the three basic features of IoT. Following the PC Internet and mobile Internet, IoT is expected to become the core driver of a new round of technological and industrial change.

The industry chain carries out the location: the key to connect things as well as the perception layer and platform layer of IoT technology

IoT communication module is located in the middle of the industry chain, which is the key to realize IoT. From the perspective of the industry chain, the barriers in the module industry are (1) technical barriers that require consideration of multiple communication protocols/formats, capacity, power consumption and special technologies; and (2) very fragmented downstream demand that requires meeting the specific needs of different customers and different application scenarios. Due to the changing and increasingly complex downstream requirements, it is difficult for chip manufacturers to provide customized services to terminal manufacturers; (3) it is also difficult for downstream terminal manufacturers to directly adopt communication chips for technical and R&D cost considerations.