What types of probe tables are there? There are two main types: one is the wafer probe table and the other is the die probe table. These two types of probe stations are introduced as follows:
1. wafer probe table: wafer probe table is used to detect the characteristics of devices on uncut wafers or fault test equipment, mainly used in the field of integrated circuits and discrete devices. Probe station and tester connection, can automatically test all the bare chips on the wafer electrical parameters and functions.wafer testing The wafer probe table realizes the reliable contact between the solder pad points on the wafer and the probes on the probe card through the high-precision four-dimensional platform and micron-level positioning accuracy, so as to test the bare chips on the wafer and record the test results or mark the marking points for processing in the next process.
2. Grain Probe Station: Grain Probe Station is a probe test device for detecting bare crystals after wafer scribing, mainly used in the field of optoelectronic devices. Since the position of the die changes after wafer slicing, the crystal probe station must record the position of each die through the entire scanning sequence and mark the test results.
Probe test is a key technology in semiconductor testing,wafer probe mainly used in semiconductor manufacturing in the wafer factory wafer products into the packaging plant before the chip test process. In order to reduce packaging costs, manufacturers need to eliminate defective bare chips on finished wafers and need to test the performance of bare chips on wafers before packaging. The same bare chips are arranged vertically and horizontally across the entire wafer area, and the number of chips on a single wafer can range from dozens to tens of thousands due to the different chip sizes of the same size wafers. Since the bare chip has no pins, the input and output signals can only be transmitted through the solder pad points, which are mainly square with a side length of about 50μm. It is necessary to introduce the pin-out signals by contacting the pads with special probes to test and verify the design parameters of the bare chip. The probe stage realizes the contact between the probe and the solder pad joints through intelligent micro-alignment and electrical contact control,probe holder and completes the testing of a bare chip by connecting with the tester. Through continuous precision stepping technology, the next DUT is moved under the probe and the alignment and contact process is repeated to complete the inertial probe test of the bare chip to be tested on a wafer, thus realizing the test of different bare chip design parameters. According to the test results, the probe table marks the unqualified products and records the coordinates to form a wafer map, thus completing the screening of bare chip defects on the wafer.