Advanced packaging will become the future research trend for semiconductor packaging technology enterprises

Advanced packaging will become the future research trend for semiconductor packaging technology enterprises

The global IC packaging industry has been divided into five stages, from traditional to advanced. wafer prober The third stage of packaging technology is referred to as advanced packaging technology.

The packaging technology for semiconductors continues to evolve from traditional to advanced.

Looking at the industrial chain, the semiconductor industry comprises of three main sectors: upstream, midstream, and downstream. Upstream includes the semiconductor equipment and materials industry. Midstream involves semiconductor manufacturing, which can be further divided into optoelectronics, sensors, discrete devices, and integrated circuits (ICs). ICs can be classified into four categories: logic chips, memory chips, analog circuits, probe test and microprocessors. As for market share, it is dominated by integrated circuits, making up over 80% of the semiconductor industry.

In terms of manufacturing technology, the industrial chain of integrated circuits can be divided into three main parts: design, production, and packaging and testing. The final stage of producing integrated circuit products is the packaging and testing process. wafer probing Many chip design companies follow the factory-free approach and do not have their own wafer manufacturing or packaging facilities. Once the chip design is complete, they hand off the layout to a wafer foundry for production, which then passes on the wafers to downstream packaging and testing companies. These companies transform the bare chips into integrated circuit components that can be directly assembled onto PCB boards, based on customer requirements for package type and technical specifications. Once the packaging is done, professional tests are conducted on parameters such as voltage, current, time, temperature, resistance, capacitance, frequency, pulse width,and duty cycle in accordance with customer specifications. After completing the packaging and testing of wafer chips, these enterprises deliver finished chips to customers and earn revenue and profits in return.